엘오티베큠

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As the semiconductor technology requirements are becoming more compact and complex, manipulation of wafer layers are becoming more precise and dynamic to control.

High-performing vacuum in vapor deposition steps will produce high-quality results such as in wafer surface analysis and property evaluation processes.
Dry vacuum pump is a key component in semiconductor technology.

XD Series

  • Pumping Speed
    • 1,200 ~1,800 ㎥/hr
    • 20,000 ~ 30,000 LPM
  • Ultimate Pressure
    • ≤ 5.0 x 10-3
    • ≤ 6.6 x 10-1

HD Series

  • Pumping Speed
    • 120 ~ 9,000 ㎥/hr
    • 2,000 ~ 150,000 LPM
  • Ultimate Pressure
    • ≤ 3.0 x 10-2 ~ 5.0 x 10-1 Torr
    • ≤ 3.9 x 10+0 ~ 6.6 x 10-1 Pa

DD Series

  • Pumping Speed
    • 100 ~ 6,000 ㎥/hr
    • 1,700 ~ 100,000 LPM
  • Ultimate Pressure
    • ≤ 5.0 x 10-3
    • ≤ 6.6 x 10-1